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Abstract Fabrication of micro- and nanoscale electronic components has become increasingly demanding due to device and interconnect scaling combined with advanced packaging and assembly for electronic, aerospace, and medical applications. Recent advances in additive manufacturing have made it possible to fabricate microscale, 3D interconnect structures but heat transfer during the fabrication process is one of the most important phenomena influencing the reliable manufacturing of these interconnect structures. In this study, optical absorption and scattering by three-dimensional (3D) nanoparticle packings are investigated to gain insight into micro/nano heat transport within the nanoparticles. Because drying of colloidal solutions creates different configurations of nanoparticles, the plasmonic coupling in three different copper nanoparticle packing configurations was investigated: simple cubic (SC), face-centered cubic (FCC), and hexagonal close packing (HCP). Single-scatter albedo (ω) was analyzed as a function of nanoparticle size, packing density, and configuration to assess effect for thermo-optical properties and plasmonic coupling of the Cu nanoparticles within the nanoparticle packings. This analysis provides insight into plasmonically enhanced absorption in copper nanoparticle particles and its consequences for laser heating of nanoparticle assemblies. 

Abstract Thermal metamaterials exhibit thermal properties that do not exist in nature but can be rationally designed to offer unique capabilities of controlling heat transfer. Recent advances have demonstrated successful manipulation of conductive heat transfer and led to novel heat guiding structures such as thermal cloaks, concentrators, etc. These advances imply new opportunities to guide heat transfer in complex systems and new packaging approaches as related to thermal management of electronics. Such aspects are important, as trends of electronics packaging toward higher power, higher density, and 2.5D/3D integration are making thermal management even more challenging. While conventional cooling solutions based on large thermal-conductivity materials as well as heat pipes and heat exchangers may dissipate the heat from a source to a sink in a uniform manner, thermal metamaterials could help dissipate the heat in a deterministic manner and avoid thermal crosstalk and local hot spots. This paper reviews recent advances of thermal metamaterials that are potentially relevant to electronics packaging. While providing an overview of the state-of-the-art and critical 2.5D/3D-integrated packaging challenges, this paper also discusses the implications of thermal metamaterials for the future of electronic packaging thermal management. Thermal metamaterials could provide a solution to nontrivial thermal management challenges. Future research will need to take on the new challenges in implementing the thermal metamaterial designs in high-performance heterogeneous packages to continue to advance the state-of-the-art in electronics packaging. 

Abstract Nanoparticle heating due to laser irradiation is of great interest in electronic, aerospace, and biomedical applications. This paper presents a coupled electromagnetic-heat transfer model to predict the temperature distribution of multilayer copper nanoparticle packings on a glass substrate. It is shown that heat transfer within the nanoparticle packing is dominated by the interfacial thermal conductance between particles when the interfacial thermal conductance constant, GIC, is greater than 20 MW/m2K, but that for lower GIC values, thermal conduction through the air around the nanoparticles can also play a role in the overall heat transfer within the nanoparticle system. The coupled model is used to simulate heat transfer in a copper nanoparticle packing used in a typical microscale selective laser sintering (μ-SLS) process with an experimentally measured particle size distribution and layer thickness. The simulations predict that the nanoparticles will reach a temperature of 730 ± 3 K for a laser irradiation of 2.6 kW/cm2 and 1304 ± 23 K for a laser irradiation of 6 kW/cm2. These results are in good agreement with the experimentally observed laser-induced sintering and melting thresholds for copper nanoparticle packing on glass substrates. 

One of the limitations of commercially available metal additive manufacturing (AM) processes is the minimum feature size most processes can achieve. A proposed solution to bridge this gap is microscale selective laser sintering (μ-SLS). The advent of this process creates a need for models which are able to predict the structural properties of sintered parts. While there are currently a number of good SLS models, the majority of these models predict sintering as a melting process which is accurate for microparticles. However, when particles tend to the nanoscale, sintering becomes a diffusion process dominated by grain boundary and surface diffusion between particles. As such, this paper presents an approach to model sintering by tracking the diffusion between nanoparticles on a bed scale. Phase field modeling (PFM) is used in this study to track the evolution of particles undergoing sintering. Changes in relative density are then calculated from the results of the PFM simulations. These results are compared to experimental data obtained from furnace heating done on dried copper nanoparticle inks, and the simulation constants are calibrated to match physical properties.